APPLICATIONS
& FEATURES:
- Used for wire bonding for various
semiconductor devices such as LED, transistor,
integrated circuit, hybrid circuit,
etc.
- Introduce oversea advanced technologies,
apply the latest program-controlled
devices, thus offer program-controlled,
accurate and reliable welding action.
- Gold wire ball fixer: spherical shape,
consistent welding point.
- Offer stable ultrasonic power output
to ensure consistent welding points
with high bonding quality.
SPECIFICATIONS£º
¡ö Diameter
of Gold Wire: ¦µ0.02mm¡«¦µ0.06mm
¡ö Moving Range
of Clamp: ¦µ24mm
¡ö Welding Press:
0.2N¡«1.5N
¡ö Welding Power:
5W
¡ö Welding Time:
5-20ms
¡ö Magnification
Times of Microscope: 10 to 60 times (magnification
changing continuously)
¡ö Power Required:
AC 220V 50Hz
¡ö Outside Dimensions:
500(L)¡Á480(W)¡Á420(H)
